The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Aug. 04, 2015
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Elisabeth Kreutzwiesner, Graz, AT;

Gernot Schulz, Graz, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/14 (2006.01); H05K 3/16 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0207 (2013.01); H05K 3/12 (2013.01); H05K 3/146 (2013.01); H05K 3/16 (2013.01); H05K 3/4608 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09136 (2013.01);
Abstract

A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.


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