Gene Wu

Title: Gene Wu: Innovator in Semiconductor Packaging

Introduction

Gene Wu is a prominent inventor based in Dayuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of three patents. His work focuses on enhancing the reliability and efficiency of wafer-level chip-scale packaging processes.

Latest Patents

One of Gene Wu's latest patents is titled "Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching." This patent describes an improved WLCSP process that involves forming conductive pillars on a semiconductor wafer's surface. The process includes dry etching grooves into the wafer, which define boundaries between multiple die. An encapsulating material is then deposited, and recesses are cut in the grooves to separate the die effectively. Another notable patent is "Packaging with base layers comprising alloy 42." This patent outlines a semiconductor packaging structure that features a base layer made of alloy, with die attached and an interconnect structure that includes vias and conductive lines.

Career Highlights

Gene Wu works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative approaches have contributed to advancements in semiconductor technology, particularly in packaging solutions that enhance performance and reliability.

Collaborations

Gene has collaborated with notable colleagues, including Steven Hsu and Jimmy Liang, who share his commitment to innovation in semiconductor technology.

Conclusion

Gene Wu's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and improve manufacturing processes.