The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Oct. 27, 2006
Applicant:
Gene Wu, Dayuan Township, TW;
Inventor:
Gene Wu, Dayuan Township, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor packaging structure is provided. The structure includes a base layer comprising alloy; die attached on a first side of the base layer; and an interconnect structure on the die, wherein the interconnect structure comprises vias and conductive lines connected to the die.