Windfall, IN, United States of America

Gary Eugene Oberlin


Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 202(Granted Patents)


Company Filing History:


Years Active: 2001-2010

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8 patents (USPTO):Explore Patents

Title: Gary Eugene Oberlin: Innovator in Electronic Assembly Technologies

Introduction

Gary Eugene Oberlin is a notable inventor based in Windfall, Indiana, with a remarkable portfolio of eight patents. His work primarily focuses on advancements in electronic assembly technologies, showcasing his commitment to innovation in the field.

Latest Patents

Among his latest patents is a method of producing an overmolded electronic module with a flexible circuit pigtail. This innovative method involves fixturing the assembly in a mold cavity, allowing a portion of the flexible circuit to protrude from the mold. It also includes a compressible elastomeric interface that seals off the mold cavity, protecting the flexible circuit from damage due to clamping forces. Additionally, the flexible circuit is pre-coated to ensure good adhesion with the molding compound, while a heat exchanger is thermally coupled to protect the circuit from thermal damage.

Another significant patent is for a fluid-cooled electronic assembly. This assembly features a sealed compartment containing a thermal cooling fluid, such as liquid, to cool an electronic device. The design includes inlet and outlet ports for the cooling liquid, fluid flow channels in thermal communication with the electronic device, and a housing that defines the sealed fluid compartment.

Career Highlights

Gary Eugene Oberlin is currently associated with Delphi Technologies, Inc., where he continues to contribute to the field of electronic assembly. His innovative approaches have led to significant advancements in the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Oberlin has collaborated with notable coworkers, including Scott David Brandenburg and Darrel Eugene Peugh. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Gary Eugene Oberlin stands out as a prominent inventor in the realm of electronic assembly technologies. His contributions through innovative patents and collaborations have significantly impacted the industry, showcasing his dedication to advancing technology.

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