The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Aug. 12, 2003
Suresh K. Chengalva, Kokomo, IN (US);
Gary E. Oberlin, Windfall, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Suresh K. Chengalva, Kokomo, IN (US);
Gary E. Oberlin, Windfall, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.