The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Oct. 27, 2003
Applicants:

Gary E. Oberlin, Windfall, IN (US);

Bruce A. Myers, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Darrel E. Peugh, Kokomo, IN (US);

Inventors:

Gary E. Oberlin, Windfall, IN (US);

Bruce A. Myers, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Darrel E. Peugh, Kokomo, IN (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); H05K 7/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.


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