Delphi Technologies, Inc.

Gary Eugene Oberlin

Scott David Brandenburg

Bruce Alan Myers

Darrel Eugene Peugh

Robert Vajagich

Morgan Daniel Murphy

Todd P Oman

Thomas Alan Degenkolb

Suresh K Chengalva

Charles A Cluff

Mark Anthony Koors

David R Little

Matthew R Walsh

David A Laudick

Douglas Allen Nunan

Charles I Delheimer

Greston T McCoy, Jr

A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.

Method of producing an overmolded electronic module with a flexible circuit pigtail

An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Fluid cooled electronic assembly

The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.

Power electronic system with passive cooling

A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.

Multi-path bar bond connector for an integrated circuit assembly

A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.

Thermally enhanced electronic module with self-aligning heat sink

An integrated circuit assembly is provided, including a substrate having at least one substrate contact surface , an integrated circuit device having at least one first contact surface , and a bar bond element . The bar bond element provides communication between the at least one substrate contact surface and the at least one first contact surface . The bar bond element includes a conductive plate element having an integrated circuit foot portion , a substrate foot portion and a strain relief loop positioned between the integrated circuit foot portion and the substrate foot portion

Integrated circuit assembly with bar bond attachment

An improved vehicle crash sensing apparatus quickly and reliably characterizes frontal impacts with only minimal data processing requirements. Two or more longitudinally separated piezoelectric strips strategically located in a frontal portion of the vehicle produce impact signals that are analyzed to characterize the type of impact and the structural crush rate. In a simple implementation involving only two piezoelectric strips, a first strip extends laterally along a forward portion of the front bumper, and a second strip extends laterally along a forward portion of the hood panel, above and rearward of the first strip. In cases where an impact signal is developed by only one of the two strips, a high (under-ride) or low (over-ride) impact is indicated. If impact signals are developed by both strips, the intervening time is measured as an indication of the structural crush rate. In a more complex implementation, the bumper and hood strips are divided into two or more individual strip segments so the center and distribution of impact and the impact vector may be quickly and reliably characterized as well.

Frontal impact characterization apparatus for a motor vehicle restraint system

A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.

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Windfall, IN, United States of America

Gary Eugene Oberlin