Ogaki, Japan

Fusaji Nagaya


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Gifu, JP (2012)
  • Ogaki, JP (2012 - 2015)

Company Filing History:


Years Active: 2012-2015

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5 patents (USPTO):Explore Patents

Title: The Innovations of Fusaji Nagaya

Introduction

Fusaji Nagaya is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring boards, holding a total of five patents. His work focuses on enhancing the manufacturing processes and performance of these essential electronic components.

Latest Patents

Nagaya's latest patents include innovative designs for printed wiring boards and methods for their manufacturing. One of his notable inventions involves a printed wiring board that features a resin layer, pads for electronic component connections, and a solder-resist layer. This design ensures that the upper surfaces of the pads and portions of their side walls are effectively exposed. Another patent addresses the issue of warping in printed wiring boards by utilizing interlayer insulation layers without core material. By incorporating inorganic particles to lower the thermal expansion coefficient and optimizing the thickness of the core substrate and insulation layers, Nagaya's design aims to prevent warping during the manufacturing process.

Career Highlights

Fusaji Nagaya has built a successful career at Ibiden Company Limited, where he has been instrumental in advancing technologies related to printed wiring boards. His expertise and innovative mindset have led to the development of several patents that enhance the reliability and efficiency of electronic components.

Collaborations

Nagaya has collaborated with notable colleagues, including Masaru Takada and Tomohiko Murata. Their combined efforts have contributed to the success of various projects within the company.

Conclusion

Fusaji Nagaya's contributions to the field of printed wiring boards exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the challenges in electronic manufacturing and provide effective solutions to enhance product performance.

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