The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Aug. 19, 2011
Masaru Takada, Ogaki, JP;
Fusaji Nagaya, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Fusaji Nagaya, Ogaki, JP;
IBIDEN CO., LTD., Ogaki-shi, JP;
Abstract
[Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrateformed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrateis set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (B) at 0.1 mm. In setting so, using thin core substrateand interlayer insulation layers (A,B) without core material, it is thought that warping does not occur in the printed wiring board.