The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Oct. 29, 2010
Applicants:
Masaru Takada, Ogaki, JP;
Fusaji Nagaya, Ogaki, JP;
Takao Okada, Ogaki, JP;
Tomohiko Murata, Ogaki, JP;
Inventors:
Masaru Takada, Ogaki, JP;
Fusaji Nagaya, Ogaki, JP;
Takao Okada, Ogaki, JP;
Tomohiko Murata, Ogaki, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.