Takao Okada

Title: Takao Okada: Innovator in Printed Wiring Board Technology

Introduction

Takao Okada is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology. With a total of 2 patents to his name, Okada's work has had a notable impact on electronic component manufacturing.

Latest Patents

Okada's latest patents focus on advancements in printed wiring boards and methods for their manufacturing. One of his patents describes a printed wiring board that includes a resin layer, pads formed on the resin layer for connecting to electronic components, and a solder-resist layer that exposes the upper surfaces and side walls of the pads. Each pad is equipped with a metal layer that is formed on the upper surfaces and the exposed portions of the side walls. Another patent outlines a method for manufacturing a printed wiring board, which involves forming a pad on a resin layer, applying a solder-resist layer, and subsequently forming a metal layer on the pad.

Career Highlights

Okada is currently associated with Ibiden Company Limited, where he continues to innovate in the field of electronics. His work has been instrumental in enhancing the efficiency and reliability of printed wiring boards, which are crucial components in modern electronic devices.

Collaborations

Throughout his career, Okada has collaborated with notable colleagues, including Masaru Takada and Fusaji Nagaya. These collaborations have further enriched his contributions to the field.

Conclusion

Takao Okada's innovative work in printed wiring board technology exemplifies the importance of continuous advancement in electronics. His patents reflect a commitment to improving manufacturing processes and enhancing product performance.