Ibiden Company Limited

Takao Okada

Masaru Takada

Fusaji Nagaya

Tomohiko Murata

A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.

Printed wiring board and method for manufacturing printed wiring board

A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.

Growing community of inventors

Ogaki, Japan

Takao Okada