Company Filing History:
Years Active: 2004-2010
Title: Fumio Murakami: Innovator in Semiconductor Manufacturing
Introduction
Fumio Murakami is a notable inventor based in Kodaira, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of five patents. His work focuses on improving the efficiency and reliability of semiconductor devices.
Latest Patents
Among his latest patents is a method of manufacturing semiconductor devices. This method involves mounting semiconductor chips facing-up on a printed wiring board, which is coated with a protective insulation film using a film-like resist. A key aspect of this innovation is the use of transfer mold technology to collectively mold multiple semiconductor chips. The design includes through holes that reach the exterior space of the lower die, which helps prevent short circuits and open circuits caused by the deformation of bonding wires connecting the semiconductor chip electrodes to the conductor patterns on the printed wiring board.
Career Highlights
Fumio Murakami has worked with Renesas Technology Corporation, where he has further honed his expertise in semiconductor technology. His career reflects a commitment to advancing the field through innovative solutions.
Collaborations
Throughout his career, Murakami has collaborated with notable colleagues, including Kenichi Imura and Bunshi Kuratomi. These partnerships have contributed to the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Fumio Murakami's contributions to semiconductor manufacturing demonstrate his innovative spirit and dedication to improving technology. His patents reflect a deep understanding of the complexities involved in semiconductor device production.