The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Aug. 19, 2004
Bunshi Kuratomi, Kodaira, JP;
Fukumi Shimizu, Tachikawa, JP;
Kenichi Imura, Higashiyamato, JP;
Katsushige Namiki, Ome, JP;
Fumio Murakami, Kodaira, JP;
Bunshi Kuratomi, Kodaira, JP;
Fukumi Shimizu, Tachikawa, JP;
Kenichi Imura, Higashiyamato, JP;
Katsushige Namiki, Ome, JP;
Fumio Murakami, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Eastern Japan Semiconductor Technologies, Inc., Tokyo, JP;
Abstract
At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.