Company Filing History:
Years Active: 2022
Title: Fu-Lung Chou: Innovating in Substrate Fabrication and Cutting Methods
Introduction
Fu-Lung Chou is a distinguished inventor based in Tainan, Taiwan, known for his contributions to innovative substrate fabrication techniques. With two patents to his name, Chou exemplifies the spirit of creativity and technical expertise that drives advancements in technology.
Latest Patents
Chou’s latest patents showcase his deep understanding of material science and manufacturing processes. His first patent, titled "Substrate having through via and method of fabricating the same," outlines a systematic approach to creating a substrate that includes a through via. The process involves providing a carrier board with a release layer, attaching the substrate, applying a light beam to create a blind hole, and further processes to finalize the substrate, integrating efficiency and precision in manufacturing.
The second patent, "Cutting method for forming chamfered corners," introduces a novel method for achieving chamfered corners in materials. This method involves selecting a light pattern-adjusting module based on a desired chamfer angle, adjusting the laser beam's characteristics, and etching the substrate to attain the chamfered surface desired. This innovative approach not only enhances production capabilities but also improves the quality of the final products.
Career Highlights
Fu-Lung Chou works at the Industrial Technology Research Institute, a leading research institution dedicated to fostering innovation and technological advancement. His role at the institute allows him to collaborate on groundbreaking projects and contribute meaningfully to the field of technology.
Collaborations
Throughout his career, Chou has collaborated with talented individuals such as Yu-Chung Lin and Hsin-Yu Chang. Working alongside these professionals has enabled him to enhance his research and development outputs, fostering an environment of shared knowledge and innovation.
Conclusion
Fu-Lung Chou is a notable inventor whose work continues to push the boundaries of substrate fabrication and cutting methods. With his impressive portfolio of patents, he is making significant strides in technology that benefit various industries. His dedication to innovation exemplifies the role of inventors in shaping the future of manufacturing processes and materials.