The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Dec. 24, 2020
Industrial Technology Research Institute, Hsinchu, TW;
Chih-I Wu, Taipei, TW;
Shih-Ming Lin, Chiayi County, TW;
Pin-Hao Hu, Kaohsiung, TW;
Yu-Chung Lin, Tainan, TW;
Hsin-Yu Chang, Tainan, TW;
Fu-Lung Chou, Tainan, TW;
Chien-Jung Huang, Tainan, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.