The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Feb. 19, 2019
Applicant:

Industrial Technology Research Institute, Hsin-Chu, TW;

Inventors:

Hsin-Yu Chang, Taichung, TW;

Fu-Lung Chou, Tainan, TW;

Chien-Jung Huang, Tainan, TW;

Yu-Chung Lin, Tainan, TW;

Min-Kai Lee, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/36 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B23K 26/362 (2014.01); B23K 103/00 (2006.01); B23K 101/36 (2006.01); B23K 101/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/362 (2013.01); B23K 2101/18 (2018.08); B23K 2101/36 (2018.08); B23K 2103/54 (2018.08);
Abstract

A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.


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