The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Dec. 21, 2022
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Fu-Lung Chou, Tainan, TW;

Chien-Jung Huang, Tainan, TW;

Yu-Chung Lin, Tainan, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/03 (2006.01); B23K 26/064 (2014.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0648 (2013.01); B23K 26/032 (2013.01); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08);
Abstract

A cavity forming method includes the steps of: providing the material modification processing device; according to the cavity topography of the workpiece, utilizing the material modification processing device to perform local modification including: calculating the laser-light shaping and scanning information, and based on the laser-light shaping and scanning information to have the optical axis adjustment unit to adjust positions of the laser-light shaping and scanning processing module and the processing stage, such that the area of the workpiece to be projected by the Bessel beam can be formed as the modified area; and, etching the modified area to form a cavity of the cavity topography. In additional, a material modification processing device is also provided.


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