Fu-Kun Yeh

Title: Fu-Kun Yeh: Innovator in Software and Thermal Process Technologies

Introduction

Fu-Kun Yeh is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the fields of software deployment and thermal process control. With a total of 2 patents, his work reflects a commitment to advancing technology in these areas.

Latest Patents

One of Fu-Kun Yeh's latest patents is a "Software deployment system and method." This innovative system includes a server and at least one client, where the server executes multiple applications simultaneously. The client controls equipment tools and manages application deployment based on specific signals. This method ensures efficient software management and resource utilization.

Another notable patent is the "Method and system for thermal process control." This system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs processes to form films on wafer surfaces, while the metrology tool inspects the film's thickness. The controller generates and calibrates the heating model, ensuring precision in thermal processing.

Career Highlights

Fu-Kun Yeh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing cutting-edge technologies that enhance manufacturing processes and product quality.

Collaborations

He has collaborated with notable colleagues, including Yung-Chih Chang and Cheng-I Sun, contributing to various projects that push the boundaries of technology.

Conclusion

Fu-Kun Yeh's innovative patents and contributions to software deployment and thermal process control highlight his role as a key figure in technological advancement. His work continues to influence the semiconductor industry and beyond.