Taiwan Semiconductor Manufacturing Comp. Ltd.

Fu-Kun Yeh

Yung-Chih Chang

Cheng-I Sun

Chun-I Kuo

Ting-Yuan Huang

Hsueh-Chi Shen

A software deployment system and method are provided. The system includes a server and at least one client. The server executes a first server application and a second server application simultaneously. The client controls at least one equipment tool, executes a first client application connected to the first server application, and has a second client application. In response to a deployment signal, the client first deletes the first client application and executes the second client application to connect to the second server application if all equipment tools controlled by the client are idle. The client then transmits a completion signal to the server. If software deployment on each client is complete, the server deletes the first server application.

Software deployment system and method

A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.

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Tainan, Taiwan

Fu-Kun Yeh