Fred Kong

Title: Fred Kong - Innovator in Semiconductor Packaging

Introduction

Fred Kong is a notable inventor based in Irvine, California, recognized for his contributions to semiconductor packaging technology. With a total of 4 patents, he has made significant advancements in the field, particularly in the design and functionality of integrated circuits.

Latest Patents

Kong's latest patents include an "Encapsulated leadframe semiconductor package for random access memory integrated circuits." This innovation features a thin, small outline IC leadframe plastic package designed for high-performance, high-speed semiconductor memory IC devices, such as dynamic random access memories (DRAM) with data transfer rates reaching 1 GigaHertz. The package utilizes electrically conductive bumps for interconnection and incorporates an interposer with curled micro-spring contacts for enhanced performance.

Another significant patent is the "Integrated multi-chip chip scale package," which presents a vertically integrated chip scale package assembly. This assembly consists of multiple single chip package subassemblies stacked vertically, allowing for efficient electrical connections and a compact design. The innovative use of wire bonding and encapsulation ensures the protection and reliability of the stacked package.

Career Highlights

Throughout his career, Fred Kong has worked with prominent companies, including Kingston Technology Company and Kingston Technology Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and packaging solutions.

Collaborations

Kong has collaborated with notable professionals in the industry, including Ramon S Co and Steve Si-Yu Chen. These partnerships have further enriched his work and innovations in semiconductor packaging.

Conclusion

Fred Kong's contributions to semiconductor packaging technology have established him as a key figure in the field. His innovative patents and collaborations reflect his commitment to advancing technology and improving the performance of integrated circuits.