The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2002
Filed:
Oct. 30, 2000
Ramon S. Co, Trabuco Canyon, CA (US);
Steve Si-Yu Chen, San Jose, CA (US);
Fred Yen Kong, Irvine, CA (US);
Thang Nguyen, Santa Ana, CA (US);
Kingston Technology Co., Fountain Valley, CA (US);
Abstract
Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.