Kingston Technology Corporation

Kingston Technology Company

Fred Kong

Ramon S Co

Wei H Koh

Thang Nguyen

Steve Si-Yu Chen

David E Chen

Daniel Yu Hsu

A thin, small outline IC leadframe plastic package to be used to assemble high performance, high speed semiconductor memory IC devices such as dynamic random access memories (DRAM) having a high data transfer rate in the range of 1 GigaHertz. The package leadframe is electrically interconnected to the IC device input-output pads by either electrically conductive (e.g. solder) bumps that are flip-chip bonded to the IC device or by of an interposer. The interposer contains integral curled micro-spring contacts at opposite ends of conductive fan out traces. The interposer is attached to the leadframe bonding pads by way of tape automated bonding, soldering, or adhesive bonding. The leadframe that is interconnected to the IC device by the aforementioned flip-chip bumps or the interposer is encapsulated and trimmed to form either gull-wing style perimeter leads as a standard thin small outline package (TSOP) or wrap around leads as a micro-leadframe (MLF) package.

Encapsulated leadframe semiconductor package for random access memory integrated circuits

A vertically integrated chip scale package (CSP) assembly comprising two or more single chip package subassemblies having an upper level CSP subassembly superimposed directly above a lower level CSP subassembly. The lower-most CSP subassembly in the vertical stack contains an array of solder balls for interconnection to a printed wiring board. The vertical electrical connection between the upper and lower level package subassemblies is accomplished by using wire bonding from perimeter wire bonding pads located on an upper level substrate extension to matching perimeter wire bonding pads located on a lower level substrate extension that is longer in length than the upper level substrate extension. The stacked package subassemblies are bonded together by using a thin adhesive material, and the perimeter wire bonds are encapsulated by an encapsulant for protection. The assembled vertical stack has the appearance of a single CSP but is shorter in height than two individual packages that are stacked together with solder ball interconnects located therebetween.

Integrated multi-chip chip scale package

A test station for testing memory modules uses multiple personal computer (PC) motherboards for performing functional tests on the modules. The motherboards are mounted upside-down with the solder-side up at the desktop level of the test station frame. One or more of the memory-module sockets on each motherboard is removed. A test adaptor board is plugged into the holes of the removed socket, but mounted on the reverse, solder side of the motherboard rather than the component side. The test adaptor board has a test socket that receives a module being tested. An overhead robotic arm picks up memory modules from an input tray and inserts them into test sockets for testing by the motherboards. Since the cables, components, and expansion boards of the motherboards are hidden below the solder-side surface of the motherboards, while the test adaptor board is above, the overhead robotic arm can easily navigate to the test socket without obstruction. Modules that pass are inspected in transit when the robotic arm holds the module in front of a camera that sends images to an image inspection processor.

Automated multi-PC-motherboard memory-module test system with robotic handler and in-transit visual inspection

Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.

Growing community of inventors

Irvine, CA, United States of America

Fred Kong