Fook Hong Lee

Title: Fook Hong Lee: Innovator in Integrated Circuit Technology

Introduction

Fook Hong Lee is a prominent inventor based in Singapore, known for his contributions to the field of integrated circuits. With a total of 6 patents to his name, he has made significant advancements in the technology that underpins modern electronics.

Latest Patents

One of Fook Hong Lee's latest patents focuses on reliable passivation for integrated circuits. The device and method presented involve a substrate with circuit components and a back-end-of-line (BEOL) dielectric layer containing interconnects. A pad dielectric layer is formed over the BEOL dielectric layer, which includes a pad via opening that exposes a surface of one of the interconnects. A pad interconnect is then formed on the pad dielectric layer, coupled to the interconnect in the BEOL dielectric by a pad via contact. Notably, the pad interconnect pattern is devoid of 90° angles and any angled structures less than 90°. A passivation layer is subsequently formed on the substrate, lining the pad interconnect and covering the exposed surface of the pad dielectric layer.

Career Highlights

Fook Hong Lee is currently employed at Globalfoundries Singapore Pte. Ltd., where he continues to innovate and develop new technologies in the semiconductor industry. His work has been instrumental in enhancing the reliability and performance of integrated circuits.

Collaborations

Throughout his career, Fook Hong Lee has collaborated with notable colleagues, including Danny Pak-Chum Shum and Danny Shum. These collaborations have contributed to the advancement of technology in their field.

Conclusion

Fook Hong Lee's contributions to integrated circuit technology exemplify the spirit of innovation. His patents and ongoing work at Globalfoundries Singapore Pte. Ltd. highlight his commitment to advancing the field.