Company Filing History:
Years Active: 2008-2011
Title: The Innovations of Feng-Yu Hsu
Introduction
Feng-Yu Hsu is a notable inventor based in Tainan Hsien, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 3 patents. His work focuses on advanced methods for creating interconnect structures and manufacturing processes that enhance the efficiency and performance of electronic devices.
Latest Patents
Feng-Yu Hsu's latest patents include a method for manufacturing a dual damascene opening comprising a trench opening and a via opening. This innovative method involves providing a substrate, forming a multi cap layer that includes a first cap layer and a second cap layer, and performing an etching process to create an opening in the second cap layer. Another significant patent is related to an interconnect structure and its fabricating method. This structure is designed to be disposed on a substrate with a conductive part and includes a first porous low-k layer, a damascene structure, and a UV cutting layer that enhances the performance of the interconnect.
Career Highlights
Feng-Yu Hsu is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to develop and refine his innovative techniques, contributing to the advancement of semiconductor technology.
Collaborations
Feng-Yu Hsu has collaborated with several talented individuals in his field, including Chun-Chieh Huang and Chih-Chien Liu. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Feng-Yu Hsu's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of electronic device manufacturing.