The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Dec. 01, 2006
Feng-yu Hsu, Tainan Hsien, TW;
Chih-chien Liu, Taipei, TW;
Jim-jey Huang, Tainan County, TW;
Jei-ming Chen, Taipei County, TW;
Feng-Yu Hsu, Tainan Hsien, TW;
Chih-Chien Liu, Taipei, TW;
Jim-Jey Huang, Tainan County, TW;
Jei-Ming Chen, Taipei County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A method for fabricating an interconnect structure is described. A substrate with a conductive part thereon is provided, a first porous low-k layer is formed on the substrate, and then a first UV-curing step is conducted. A damascene structure is formed in the first porous low-k layer to electrically connect with the conductive part, and then a first UV-absorption layer is formed on the first porous low-k layer and the damascene structure. A second porous low-k layer is formed on the first UV-absorption layer, and a second UV-curing step is conducted.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile