Beijing, China

Feng Pan

This inventor holds 26 USPTO granted patents and 2 EPO patents, primarily in Virtual Reality Technology. Top assignees: Beijing Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd., Vmware, Inc.. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feng Pan. Retrieved from https://idiyas.com/inventor/feng-pan-onnhujmf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 88.5

 

Average Co-Inventor Count = 6.9

ph-index = 3

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 2005-2026

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Areas of Expertise:
Surface Acoustic Wave Device
Runtime State Information
Overlay Network
Virtual Reality Device
Ethylene Oligomerization
Backlight Driving Circuit
Software-Defined Networking
Bathymetric Sonar System
Security Functional Thin Film
Control-Plane Connectivity
Image Processing
Current Compensation Circuit
26 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Feng Pan

Introduction: Feng Pan is a visionary inventor based in Beijing, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Feng Pan holds several patents in the areas of artificial intelligence, renewable energy, and smart devices, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Feng Pan has worked with leading tech companies in China, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Feng Pan has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge sharing within the global tech community.

Conclusion: Feng Pan's relentless pursuit of innovation and his passion for creating technology that improves lives make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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