Company Filing History:
Years Active: 2012-2023
Title: Innovations of Fangfang Li in Integrated Circuit Design
Introduction
Fangfang Li is a prominent inventor based in Shanghai, China, known for his contributions to the field of integrated circuit design. With a total of four patents to his name, he has made significant advancements in the efficient implementation of three-dimensional integrated circuits (3D-IC) and the optimization of input-output pins in integrated circuit designs.
Latest Patents
Fangfang Li's latest patents include innovative methods, systems, and computer program products aimed at enhancing the design and implementation of 3D-ICs. One of his notable patents discloses an improved approach for efficiently implementing a 3D-IC design with heterogeneous and/or homogeneous dies. This invention identifies a first die design and a second die design, generating a wrapper design for circuit components in the second die for concurrent implementation. Another significant patent focuses on the concurrent placement of input-output pins and internal components in an integrated circuit design. This method allows for the optimization of IO pins and internal components while adhering to specific constraints, ensuring a more flexible and efficient design process.
Career Highlights
Fangfang Li has worked with leading companies in the technology sector, including Cadence Design Systems, Inc. and Syntest Technologies, Inc. His experience in these organizations has contributed to his expertise in electronic design automation and integrated circuit development.
Collaborations
Throughout his career, Fangfang Li has collaborated with notable professionals in the field, including Xincheng Zhang and Laung-Terng Wang. These collaborations have further enriched his work and innovations in integrated circuit design.
Conclusion
Fangfang Li's contributions to the field of integrated circuit design through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of electronic design and innovation.