Cadence Design Systems, Inc.

Syntest Technologies, Inc.

Fangfang Li

Xincheng Zhang

Laung-Terng Wang

Shianling Wu

Pinhong Chen

Zhigang Jiang

Hao-Jan Chao

Liqun Deng

Jianping Yan

Feifei Zhao

Anil Kumar Mishra

Jinsong Liu

Lizhen Yu

Jieqian Yu

Jian An

Hanqi Yang

Ximing Zhou

Md Shaukat Ullah

Feng Cheng

Disclosed is an improved approach for efficiently implementing a three-dimensional integrated circuit (3D-IC) design with heterogeneous and/or homogeneous dies. A first die design and a second die design in a three-dimensional (3D) electronic design maybe identified, and a wrapper design may be generated for at least a block of circuit component designs in the second die design for concurrent implementation of both the first and the second die designs. Both the first and the second dies of the 3D electronic design are concurrently implemented based at least upon a floorplan that is generated with at least the wrapper design for the 3D electronic design. A first wrapper and a second wrapper may be respectively generated for the first die design and the second die design based at least in part upon a result of the concurrent implementation.

Methods, systems, and computer program products for efficiently implementing a 3D-IC

Embodiments disclosed herein describe systems, methods, and products for concurrently placing and optimizing input-output (IO) pins and internal components of an integrated circuit (IC) design. In an illustrative process flow, the computer (executing an illustrative EDA tool) may import the IC design and unplace the IO pins of the imported IC design. The computer may set one or more constraints for the IO pins with more degrees of freedom than the conventional pre-fixed locations. The computer may then concurrently place the IO pins and the internal components such that the IO pins obey the one or more constraints. The computer may iteratively optimize the placement of the IO pins and the internal components while ensuring that the one or more constraints are not violated.

Systems and methods of concurrent placement of input-output pins and internal components in an integrated circuit design

Various embodiments provide for modeling a power and ground (PG) mesh for a circuit design placement process. For some embodiments, a reference PG mesh can be used to generate a PG mesh model for a circuit design. A PG mesh model can be generated for a circuit design by calculating how much routing resource is occupied by the reference PG mesh of the circuit design, and the resulting PG mesh model can be applied to the circuit design by removing a similar amount of routing resource from the circuit design during a placement circuit design flow. Additionally (or alternatively), a PG mesh model can be generated to comprise a set of metal obstructions that correspond to each macro of the circuit design, and the PG mesh model can be applied to the circuit design by adding the metal obstructions to one or more metal layers of the circuit design.

Power and ground mesh modeling for placement in circuit design

A method for providing ordered capture clocks to detect or locate faults within N clock domains and faults crossing any two clock domains in an integrated circuit or circuit assembly in scan-test or self-test mode, where N&#x3e;1, each clock domain having one capture clock and a plurality of scan cells, each capture clock comprising a plurality of capture clock pulses; said method comprising: (a) generating and shifting-in N test stimuli to all said scan cells within said N clock domains in said integrated circuit or circuit assembly during a shift-in operation; (b) applying an ordered sequence of capture clocks to all said scan cells within said N clock domains, the ordered sequence of capture clocks comprising at least a plurality of capture clock pulses from two or more selected capture clocks placed in a sequential order such that all clock domains are never triggered simultaneously during a capture operation; and (c) analyzing output responses of all said scan cells to locate any faults therein.

Multiple-capture DFT system to reduce peak capture power during self-test or scan test

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Shanghai, China

Fangfang Li