Eun Hye Do

Title: Eun Hye Do: Innovator in Semiconductor Technology

Introduction

Eun Hye Do is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His innovative work has advanced the design and functionality of semiconductor packages.

Latest Patents

One of Eun Hye Do's latest patents involves a semiconductor package that includes stacked semiconductor chips. This design features semiconductor chips that are offset-stacked to expose edge regions adjacent to their first side surfaces. The package incorporates chip pads located in each of the edge regions of the semiconductor chips. These chip pads consist of a plurality of first chip pads arranged in a first column and a plurality of second chip pads arranged in a second column. Additionally, the design includes a horizontal common interconnector that connects the second chip pad of one semiconductor chip to the first chip pad of another semiconductor chip. Furthermore, a vertical common interconnector connects the second chip pad of the uppermost semiconductor chip to the first chip pad of the same chip, which is linked to the horizontal common interconnector.

Career Highlights

Eun Hye Do has worked with notable companies in the semiconductor industry, including SK Hynix Inc. and Hynix Semiconductor Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Eun Hye Do has collaborated with several talented individuals in his field, including Cheol Ho Joh and Ji Eun Kim. Their teamwork has contributed to the successful development of various semiconductor technologies.

Conclusion

Eun Hye Do's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of semiconductor packaging.