The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Apr. 15, 2014
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Eun Hye Do, Suwon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package includes a substrate including a core layer having a first surface and a second surface which is opposite to the first surface, a wiring layer formed over the first and second surfaces and in an inside of the core layer, and having a first electrode disposed in the inside of the core layer and exposed from the core layer and a second electrode disposed over the first surface, and a passivation layer formed over the first and second surface of the core layer such that the first and the second electrodes are exposed; a first semiconductor chip disposed over the first surface of the core layer; a second semiconductor chip stacked over the first semiconductor chip; a first connection member for connecting the first semiconductor chip with the first electrode; and a second connection member for connecting the second semiconductor chip with the second electrode.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile