The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 02, 2011
Kyu Won Lee, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun Hye DO, Suwon-si, KR;
Ji Eun Kim, Suwon-si, KR;
Hee Min Shin, Cheongju-si, KR;
Kyu Won Lee, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun Hye Do, Suwon-si, KR;
Ji Eun Kim, Suwon-si, KR;
Hee Min Shin, Cheongju-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.