The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Dec. 27, 2007
Woong Sun Lee, Gyeonggi-do, KR;
IL Hwan Cho, Gyeonggi-do, KR;
Myung Geun Park, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun Hye DO, Gyeonggi-do, KR;
Ki Young Kim, Gyeonggi-do, KR;
Ji Eun Kim, Gyeonggi-do, KR;
Jong Hyun Nam, Gyeonggi-do, KR;
Woong Sun Lee, Gyeonggi-do, KR;
Il Hwan Cho, Gyeonggi-do, KR;
Myung Geun Park, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun Hye Do, Gyeonggi-do, KR;
Ki Young Kim, Gyeonggi-do, KR;
Ji Eun Kim, Gyeonggi-do, KR;
Jong Hyun Nam, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized.