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For the Inventor, By the Inventor

Singapore, Singapore

Eric Tan Swee Seng

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2004-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric Tan Swee Seng. Retrieved from https://idiyas.com/inventor/eric-tan-swee-seng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 88.9

Average Co-Inventor Count = 1.7

ph-index = 9

Forward Citations = 597(Granted Patents)


Company Filing History:

goldMedal18 out of 39,325 
 
Micron Technology Incorporated
 patents

Years Active: 2004-2021

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Areas of Expertise:
Multi-Chip Modules
Semiconductor Dice
Device Assemblies
Microelectronic Components
Wire Bonds
Interposers
Ball Grid Array
Manufacturing Methods
Reduced Footprint
Invertible Packages
Recessed Wire Bonds
Discrete Spacers
18 patents (USPTO):Explore Patents
1. 11101245 - Multi-chip modules including stacked semiconductor dice (2021-08-24),
2. 9269695 - Semiconductor device assemblies including face-to-face semiconductor dice and related methods (2016-02-23),
3. 9070641 - Methods for forming assemblies and multi-chip modules including stacked semiconductor dice (2015-06-30),
4. 8384200 - Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies (2013-02-26),
5. 8237290 - Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads (2012-08-07),
6. 7691726 - Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components (2010-04-06),
7. 7528007 - Methods for assembling semiconductor devices and interposers (2009-05-05),
8. 7492039 - Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads (2009-02-17),
9. 7368810 - Invertible microfeature device packages (2008-05-06),
10. 7365424 - Microelectronic component assemblies with recessed wire bonds and methods of making same (2008-04-29),
11. 7276790 - Methods of forming a multi-chip module having discrete spacers (2007-10-02),
12. 7274095 - Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers (2007-09-25),
13. 7259451 - Invertible microfeature device packages (2007-08-21),
14. 7218001 - Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components (2007-05-15),
15. 6951982 - Packaged microelectronic component assemblies (2005-10-04),

Title: **Eric Tan Swee Seng: A Pioneer in Semiconductor Innovations**

Introduction

Eric Tan Swee Seng is a notable inventor based in Singapore, contributing significantly to the field of semiconductor technology. With 18 patents to his name, his work reflects the innovative spirit and technical expertise that drives advancements in electronics.

Latest Patents

Eric's latest patents include groundbreaking developments in multi-chip modules and semiconductor device assemblies. One of his inventions focuses on multi-chip modules that feature stacked semiconductor devices with spacers between them. This innovation allows discrete conductive elements to extend over the active surface of an underlying semiconductor device, enhancing connectivity through carefully designed openings.

Another significant patent details methods for manufacturing semiconductor device assemblies. This process involves attaching the backside of a first semiconductor die to a substrate and establishing structural and electrical connections between conductive elements and bond pads on the active surface of the semiconductor die. His inventions improve the performance and efficiency of semiconductor devices, showcasing his expertise in this vital industry.

Career Highlights

Eric Tan is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His role involves pioneering research and development that has far-reaching implications for both consumer electronics and industrial applications.

Collaborations

Throughout his career, Eric has collaborated with talented colleagues, including Lim Thiam Chye and Setho Sing Fee. These partnerships have fostered an environment of innovation, allowing them to tackle complex challenges in semiconductor technology and contribute to significant advancements in the field.

Conclusion

Eric Tan Swee Seng exemplifies the potential of innovation within the semiconductor industry. His patents not only demonstrate technical ingenuity but also pave the way for future developments in technology. As he continues to contribute to advancements at Micron Technology Incorporated, Eric remains a vital figure in the landscape of modern inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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