Erfeng Ding

Title: The Innovative Contributions of Erfeng Ding

Introduction

Erfeng Ding is a notable inventor based in Clifton Park, NY (US), recognized for his significant contributions to the field of integrated circuits. With a total of five patents to his name, Ding has made strides in developing advanced technologies that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents is the "Anti-fuse for an integrated circuit (IC) product and method of making such an anti-fuse for an IC product." This invention describes an illustrative IC product that includes a first conductive line positioned at a first level and a first conductive structure at a second level, which is lower than the first. The design also features a second conductive structure that is coupled to the first conductive line, with portions positioned at different levels and separated by insulating material. Another significant patent is the "Device/health of line (HOL) aware eBeam based overlay (EBO OVL) structure." This patent outlines a method for generating a device layout of an EBO OVL structure, simulating process margins, and enabling devices for optimal performance.

Career Highlights

Erfeng Ding is currently employed at GlobalFoundries Inc., where he continues to innovate and contribute to the semiconductor industry. His work focuses on enhancing integrated circuit designs and improving manufacturing processes.

Collaborations

Ding has collaborated with esteemed colleagues such as Guoxiang Ning and Hongliang Shen, further enriching his research and development efforts.

Conclusion

Erfeng Ding's innovative patents and contributions to integrated circuit technology underscore his role as a leading inventor in the field. His work not only advances technology but also sets a foundation for future developments in electronic devices.