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For the Inventor, By the Inventor

Taipei, Taiwan

Ellis Lee

USPTO Granted Patents = 11

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 125(Granted Patents)


Location History:

  • Taipei, TW (2001 - 2006)
  • Hsin-Chu, TW (2003 - 2008)

Company Filing History:

goldMedal11 out of 7,082 
 
United Microelectronics Corp.
 patents

Years Active: 2001-2008

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11 patents (USPTO):Explore Patents
1. 7412394 - System and method for founding establishment through internet (2008-08-12),
2. 6987057 - Method making bonding pad (2006-01-17),
3. 6940146 - Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same (2005-09-06),
4. 6914318 - Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same (2005-07-05),
5. 6888247 - Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same (2005-05-03),
6. 6794752 - Bonding pad structure (2004-09-21),
7. 6657283 - Reducing relative stress between HDP layer and passivation layer (2003-12-02),
8. 6492732 - Interconnect structure with air gap compatible with unlanded vias (2002-12-10),
9. 6492256 - Method for forming an interconnect structure with air gap compatible with unlanded vias (2002-12-10),
10. 6245635 - Method of fabricating shallow trench isolation (2001-06-12),
11. 6171960 - Method of fabricating copper interconnection (2001-01-09),

Title: Innovations and Contributions of Inventor Ellis Lee

Introduction

Ellis Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the areas of internet-based systems and semiconductor manufacturing. With a total of 11 patents to his name, Lee's work has had a considerable impact on modern technological advancements.

Latest Patents

One of Ellis Lee's latest patents is a "System and method for founding establishment through internet." This innovative system aims to expedite the foundation of establishments via the Internet. It includes a data storage device with built-in databases and an electronic hub that connects to the data storage device through a computer program. The electronic hub facilitates communication, examination, and matching of resource providers, thereby speeding up the establishment's foundation process.

Another notable patent is the "Method making bonding pad." This invention features a bonding pad structure that includes a passivation layer over a copper layer, which has a pad window exposing a portion of the copper layer. The design incorporates a barrier layer that conforms to the pad window's profile and an aluminum pad located within the pad window. This metal layer enhances the adhesion properties between the copper layer and the bonding wire, improving overall performance.

Career Highlights

Ellis Lee is currently employed at United Microelectronics Corporation, a leading semiconductor company. His work at this organization has allowed him to develop and refine his innovative ideas, contributing to the company's success in the industry.

Collaborations

Throughout his career, Ellis Lee has collaborated with notable colleagues, including Tsing-Fong Hwang and Shih-Wei Sun. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ellis Lee's contributions to technology through his patents and work at United Microelectronics Corporation highlight his role as an influential inventor. His innovative systems and methods continue to shape the future of technology, demonstrating the importance of creativity and collaboration in the field.

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