Eiichi Hayashi

USPTO Granted Patents = 20 (Patent Applications = 1)

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 22(Granted Patents)

Location History:

Kanagawa, JP (2011 - 2014)
Kanagawa-ken, JP (2014)
Atsugi, JP (2011 - 2017)
Kawasaki, JP (2013 - 2022)

Company Filing History:

Shinko Electric Industries Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2011-2022

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11482437 - Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board (2022-10-25),

2. 11259412 - Through hole filling paste (2022-02-22),

3. 11121020 - Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board (2021-09-14),

4. 10076029 - Method for producing printed wiring board (2018-09-11),

5. 9547152 - Plastic optical element and optical scanner and imaging forming device including the same (2017-01-17),

6. 9151930 - Plastic optical element, mold for forming the plastic optical element, light scanning device and image forming apparatus having the light scanning device (2015-10-06),

7. 9060456 - Production method of multilayer printed wiring board and multilayer printed wiring board (2015-06-16),

8. 8992713 - Process for producing multilayer printed wiring board (2015-03-31),

9. 8873124 - Plastic optical element, optical scanner including the plastic optical element, and image forming apparatus including same (2014-10-28),

10. 8824035 - Molded plastic part, method for molding plastic part, and optical scanning device using the molded plastic part (2014-09-02),

11. 8749863 - Plastic article, method of shaping plastic article, and optical scanning device having plastic article (2014-06-10),

12. 8743444 - Optical scanning device, image forming apparatus, scanning lens, and molding method of the scanning lens (2014-06-03),

13. 8533942 - Production method of multilayer printed wiring board and multilayer printed wiring board (2013-09-17),

14. 8457530 - Plastic optical element, optical scanning device, and image forming apparatus (2013-06-04),

15. 8337655 - Process for producing multilayer printed wiring board (2012-12-25),

Title: Eiichi Hayashi: Pioneering Inventor from Kanagawa, JP

Introduction: Eiichi Hayashi is a renowned inventor hailing from Kanagawa, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hayashi's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles and innovative solutions for renewable energy storage systems.

Career Highlights: With over two decades of experience in the tech industry, Hayashi has held key roles in leading research institutions and tech companies, driving forward cutting-edge projects and securing numerous patents along the way.

Collaborations: Throughout his career, Hayashi has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Eiichi Hayashi's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his position as a trailblazing inventor in the global tech community.

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1 patent pending:

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