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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10076029 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Feb. 27, 2015

Method for producing printed wiring board

Applicant:

Ajinomoto Co., Inc., Tokyo, JP;

Inventors:

Masanori Ohkoshi, Kawasaki, JP;

Ikumi Sawa, Kawasaki, JP;

Genjin Mago, Kawasaki, JP;

Eiichi Hayashi, Kawasaki, JP;

Assignee:

Ajinomoto Co., Inc., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Ian Rummel

Int. Cl.
CPC ...
H05K 1/03 (2006.01); C09J 163/00 (2006.01); H05K 3/00 (2006.01); B32B 38/10 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/18 (2006.01); H05K 3/46 (2006.01); C09J 7/22 (2018.01); C09J 7/25 (2018.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); C09J 7/22 (2018.01); C09J 7/255 (2018.01); C09J 163/00 (2013.01); H05K 3/4673 (2013.01); B32B 2309/025 (2013.01); B32B 2457/08 (2013.01); C08K 3/013 (2018.01); C09J 2201/122 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); H05K 2201/0209 (2013.01); H05K 2203/06 (2013.01); Y10T 428/24843 (2015.01); Y10T 428/2826 (2015.01);
Abstract

Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.

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