Rehovot, Israel

Efraim Dvash

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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3 patents (USPTO):Explore Patents

Title: Efraim Dvash: Innovator in Additive Manufacturing

Introduction

Efraim Dvash is a notable inventor based in Rehovot, Israel. He has made significant contributions to the field of additive manufacturing, holding three patents that showcase his innovative approaches to fabrication techniques. His work is instrumental in advancing the capabilities of manufacturing processes.

Latest Patents

Dvash's latest patents include a method and system for fabricating cross-layer patterns. This method involves an additive manufacturing system that dispenses a patterning material onto a receiving medium to create a first pattern element. It further includes dispensing a first layer of modeling material onto the first pattern element, forming an open cavity that exposes part of the first pattern element. Additionally, he has developed a method for in situ sintering of conductive ink, which involves dispensing a modeling material and conductive ink to create a conductive element, enhancing the efficiency of manufacturing processes.

Career Highlights

Efraim Dvash is currently employed at Stratasys, Inc., a leading company in the field of 3D printing and additive manufacturing. His work at Stratasys has allowed him to explore and implement innovative solutions that push the boundaries of traditional manufacturing techniques.

Collaborations

Throughout his career, Dvash has collaborated with talented individuals such as Ira Yudovin-Farber and Daniel Dikovsky. These collaborations have contributed to the development of advanced technologies in the additive manufacturing sector.

Conclusion

Efraim Dvash is a prominent figure in the realm of additive manufacturing, with a focus on innovative methods that enhance production capabilities. His patents reflect a commitment to advancing technology in this dynamic field.

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