For the Inventor, By the Inventor

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Rehovot, Israel

Stratasys, Inc.

USPTO Granted Patents = 656

% Expired Patents = 7.0

CIPO Patents = 8

EPO Patents = 224

Trademarks = 44

Forward Citations = 15,609

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460 inventors (with patents filed for the assignee):

J Samuel Batchelder (88 out of 159 patents)

William J Swanson (83 out of 118 patents)

Eduardo Napadensky (53 out of 61 patents)

4. Daniel Dikovsky (37 out of 39 patents)

5. Kevin C Johnson (32 out of 42 patents)

6. Eliahu M Kritchman (28 out of 53 patents)

7. William R Priedeman, Jr (26 out of 27 patents)

8. S Scott Crump (25 out of 26 patents)

9. James W Comb (24 out of 26 patents)

10. Michael D Bosveld (23 out of 24 patents)

11. Dominic F Mannella (23 out of 26 patents)

12. Patrick W Turley (23 out of 23 patents)

13. Shai Hirsch (22 out of 22 patents)

14. Paul J Leavitt (22 out of 22 patents)

15. Avraham Levy (21 out of 23 patents)

Core Competencies:

Thermoplastic Materials

3D Printing Systems

Print Head Technology

Polyamide Formulations

Extrusion Processes

Surface Quality

Waste Management

Layer Leveling

Radiation Curable Resins

Stereolithography

Cooling Systems

Material Formulations

656 patents: Sort by Forward Citations

1. 12754524 - System and method of printing a colored three-dimensional object (2026-10-06),

2. 12752491 - 3D printer status and health monitoring with illuminated status display indicator (2026-10-06),

3. 12741424 - System and method for printing a labeled three-dimensional object (2026-09-22),

4. 12734752 - 3D printer with head carriage with filament cutter and removable print head (2026-09-15),

5. 12728587 - Method and system for three-dimensional printing on fabric (2026-09-08),

6. D1144565 - Bottle for dispensing resin with integrated handle (2026-08-25),

7. 12709697 - (METH)ACRYLATE-FUNCTIONAL RADIATION CURABLE COMPOSITIONS FOR ADDITIVE FABRICATION (2026-08-18),

8. D1139506 - Material development kit beaker holder (2026-08-04),

9. D1139505 - Material development mini-head (2026-08-04),

10. D1139504 - Material development kit no-drip jig (2026-08-04),

11. 12697777 - Method and system for extended three-dimensional printing (2026-08-04),

12. 12686787 - Biodegradable and/or compostable biobased powders for additive manufacturing, and methods for the use thereof (2026-07-21),

13. 12686175 - Method of printing a multi-material 3D part and purge tower (2026-07-21),

14. 12679030 - Thermal barrier for tool port into heated build chamber of 3D printer (2026-07-14),

15. 12674015 - Dual cure 3D printing resins (2026-07-07),

Company Overview

Stratasys, Inc., headquartered in Rehovot, Israel, is a leader in the field of additive manufacturing, specializing in advanced 3D printing technologies. The company focuses on developing innovative solutions utilizing thermoplastic materials and sophisticated print head technology, catering to various industries including aerospace, automotive, and healthcare. Stratasys is committed to enhancing surface quality and optimizing extrusion processes, while also addressing waste management and layer leveling challenges in 3D printing applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

656 Patents

#2 in Rehovot

#8 in Israel

#1,515 in the World

Rehovot, Israel

Stratasys, Inc.

Forward Citations = 15,609

460 inventors:

J Samuel Batchelder (88 out of 159 patents)

William J Swanson (83 out of 118 patents)

Eduardo Napadensky (53 out of 61 patents)

4. Daniel Dikovsky (37 out of 39 patents)

5. Kevin C Johnson (32 out of 42 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Stratasys, Inc.. Retrieved from https://idiyas.com/company/stratasys

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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