The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Mar. 24, 2016
Applicant:
Stratasys Ltd., Rehovot, IL;
Inventors:
Assignee:
Stratasys Ltd., Rehovot, IL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/112 (2017.01); H05K 3/46 (2006.01); B33Y 80/00 (2015.01); H05K 1/18 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1291 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H05K 3/125 (2013.01); H05K 3/1283 (2013.01); H05K 3/4664 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3406 (2013.01); H05K 1/185 (2013.01); H05K 2203/013 (2013.01); H05K 2203/1131 (2013.01);
Abstract
A method of manufacturing a conductive element is disclosed. The method being executed by an additive manufacturing system and comprises: dispensing a modeling material on a receiving medium to form a layer, and dispensing a conductive ink on the layer of modeling material to form a conductive element. In some embodiments of the invention the modeling material comprises a sintering inducing agent, and in some embodiments of the present invention a sintering inducing composition is dispensed separately from the modeling material and separately from the conductive ink.