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Garland, TX, United States of America

Edgardo R Hortaleza

USPTO Granted Patents = 11

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 83(Granted Patents)

Company Filing History:

11 out of 29,232

Texas Instruments Corporation

Years Active: 1999-2009

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7476597 - Methods and systems for laser assisted wirebonding (2009-01-13),

2. 7351651 - Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits (2008-04-01),

3. 7061114 - Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits (2006-06-13),

4. 6686291 - Undercut process with isotropic plasma etching at package level (2004-02-03),

5. 6657311 - Heat dissipating flip-chip ball grid array (2003-12-02),

6. 6182882 - Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe (2001-02-06),

7. 6131792 - Balancing of x and y axis bonding by 45 degree capillary positioning (2000-10-17),

8. 6112973 - Angled transducer-dual head bonder for optimum ultrasonic power (2000-09-05),

9. 6089443 - Balancing of x and y axis bonding by 45 degree capillary positioning (2000-07-18),

10. 5984162 - Room temperature ball bonding (1999-11-16),

11. 5960262 - Stitch bond enhancement for hard-to-bond materials (1999-09-28),

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