The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Sep. 23, 1998
Orlando F Torres, Richardson, TX (US);
Edgardo R Hortaleza, Garland, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of bonding a wire between a semiconductor die pad and a lead finger of a lead frame which includes providing a capillary having a bore and a wire pigtail extending through the bore and externally of the capillary. A ball is formed with the pigtail, a semiconductor die pad is provided and a ball bond is formed on the die pad with the ball. A lead frame finger is provided and the capillary and the wire threaded through the bore are moved to the lead frame finger. A stitch bond is formed on the lead finger with the capillary. The capillary is moved from the stitch bond with a pigtail of the wire extending out of the bore of the capillary. A second ball is formed with the pigtail and the capillary is again moved toward the stitch bond until the second ball contacts the stitch bond. A ball bond is then formed over and secured to the stitch bond and to the lead frame finger. The wire is preferably a gold alloy and the wire bond location includes a copper trace adhered to a flexible electrically insulating film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile