The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2003
Filed:
May. 16, 2002
Applicant:
Inventors:
Edgardo R. Hortaleza, Garland, TX (US);
Orlando F. Torres, Richardson, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 7/20 ; H01L 2/348 ; H01L 2/3053 ; H01L 2/144 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 7/20 ; H01L 2/348 ; H01L 2/3053 ; H01L 2/144 ; H01L 2/352 ;
Abstract
A heat dissipating flip-chip Ball Grid Array (BGA) ( ) including a substrate ( ), a die ( ), a first set of solder balls ( ) coupling the die with the substrate, a thermal compound ( ) attached to a backside of the die, a second set of solder balls ( ) attached to the substrate, and a printed circuit board ( ) that includes a heat dissipating metal ( ). The heat dissipating metal is in contact with the thermal compound, and the second set of solder balls is connected to thermal vias in the printed circuit board.