The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
May. 20, 1997
Applicant:
Inventor:
Edgardo R. Hortaleza, Garland, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 7/120 ;
U.S. Cl.
CPC ...
H01L 7/120 ;
Abstract
A method ( ) of fabricating a micromechanical device ( ) by performing spacer layer undercutting ( ) and passivation at the package level. A back-end assembly process utilizes a full-cut saw process to separate the partially fabricated micromechanical devices. The individual die are then attached by pick and place equipment to a lead frame and are wire bonded, before the die are undercut. This technique avoids the generation of any particles from becoming lodged under movable structure during the cut process, and further, reduces the susceptibility of the die to damage or particles generated during the pick and place process.