Durodami Lisk

Title: Durodami Lisk: Innovator in Integrated Circuit Technology

Introduction

Durodami Lisk is a notable inventor based in San Diego, CA, who has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, Lisk has developed innovative solutions that enhance the performance and efficiency of electronic devices.

Latest Patents

Lisk's latest patents include a "Package comprising channel interconnects located between solder interconnects." This invention describes a device that features a first package and a second package connected through solder interconnects. The first package contains a substrate with dielectric layers and interconnects, while the second package includes additional integrated devices and channel interconnects strategically placed for optimal performance.

Another significant patent is for "Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods." This innovation involves multi-die IC packages that utilize split dies stacked to conserve package area. The design allows for efficient signal routing without the need for through-silicon-vias, thereby improving the overall functionality and heat dissipation of the device.

Career Highlights

Durodami Lisk is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work focuses on advancing integrated circuit technologies that are crucial for modern electronic devices.

Collaborations

Lisk collaborates with talented professionals in his field, including Aniket Patil and Hong Bok We, who contribute to the innovative projects at Qualcomm.

Conclusion

Durodami Lisk's contributions to integrated circuit technology through his patents and work at Qualcomm highlight his role as a key innovator in the industry. His inventions not only enhance device performance but also pave the way for future advancements in electronics.