Duan Feng

Title: Innovations by Inventor Duan Feng in Electronic Packaging

Introduction: Duan Feng is an accomplished inventor based in Zhuhai, China, renowned for his significant contributions in the field of electronic component packaging. With a total of four registered patents, Feng has been instrumental in developing innovative methodologies that enhance the performance and reliability of electronic devices.

Latest Patents: Among his latest patents, Feng has developed groundbreaking methods and systems for packaging electronic components. One notable patent is a method for packaging an electronic component in a package with an organic back end. This innovative approach includes a front part of the package equipped with an inner section housing a cavity opposite the resonator defined by a raised frame, along with an outer section that seals this cavity. The back part comprises a back cavity and an outer back section, further equipped with vias for coupling to front and back electrodes of the electronic component, which terminate in external contact pads to facilitate a 'flip chip' configuration to a circuit board. Another patent discusses a packaged electronic component that encapsulates the electronic element within a sophisticated package structure designed to optimize functionality and connectivity.

Career Highlights: Duan Feng's expertise lies in the area of electronic packaging technologies, where he harnesses his skills to push the boundaries of design and functionality. His work at Zhuhai Crystal Resonance Technologies Co., Ltd. highlights his role in advancing the field, ensuring that his inventions align with the latest technological advancements and market needs.

Collaborations: Throughout his career, Feng has collaborated with esteemed colleagues, including Dror Hurwitz and BawChing Perng. These partnerships have been vital in fostering a dynamic environment of research, innovation, and technological development, allowing for the exchange of ideas that lead to successful patent applications.

Conclusion: Duan Feng's contributions to the realm of electronic packaging represent a remarkable intersection of innovation and practical application. His patents not only showcase his inventive prowess but also set a benchmark for future developments in the electronic components sector. The ongoing efforts and collaborations with industry colleagues further solidify his status as a leading inventor in this dynamic field.