The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jun. 09, 2021
Applicant:

Zhuhai Crystal Resonance Technologies Co., Ltd., Guangdong, CN;

Inventors:

Dror Hurwitz, Zhuhai, CN;

Bawching Perng, Zhuhai, CN;

Duan Feng, Zhuhai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H03H 9/17 (2006.01); H10N 30/20 (2023.01); H10N 30/85 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H03H 9/02015 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H03H 9/174 (2013.01); H10N 30/2047 (2023.02); H10N 30/852 (2023.02); H10N 30/877 (2023.02);
Abstract

A package for an electronic component, the package comprising a front end, a back end, and an active membrane layer sandwiched between front and back electrodes of conducting material; wherein front electrode has a surface that extends beyond an adjacent surface of the active membrane layer, the active membrane mechanically supported by the front end and covered by a back end comprising at least one back cavity having organic walls and lid of organic material, with filled through vias traversing the organic walls and lid for coupling to the electrodes by an internal routing layer; the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.


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