BawChing Perng

Title: BawChing Perng: Innovating Electronic Component Packaging

Introduction

BawChing Perng is an accomplished inventor based in Zhuhai, China, recognized for his innovations in electronic component packaging. With a remarkable portfolio that includes four patents, he has significantly contributed to the field of advanced electronics, particularly in the design and fabrication of packaged electronic components.

Latest Patents

BawChing Perng's latest patents focus on groundbreaking methods for packaging electronic components. One noteworthy patent describes a method for packaging an electronic component in a package with an organic back end. This method involves a front part of the package that includes an inner section with a cavity opposite the resonator, defined by a raised frame, and an outer section sealing that cavity. The back part incorporates features such as a back cavity and vias through the back end to facilitate connections to electrodes and provide a 'flip chip' configuration with circuit boards.

Another related patent outlines a packaged electronic component comprising essential structural elements such as a front part with a front cavity and a back part sealing the package. This innovation allows for better coupling to circuit boards through external contact pads.

Career Highlights

BawChing Perng is currently employed at Zhuhai Crystal Resonance Technologies Co., Ltd., where he continues to advance his research and development endeavors in electronics. His contributions have also been recognized through his patents that showcase the critical advancements in the manufacturing processes of electronic components.

Collaborations

Throughout his career, BawChing has worked alongside notable colleagues, including Dror Hurwitz and Duan Feng. Their combined expertise fosters a collaborative environment that enhances the innovation process in their projects, leading to the development of cutting-edge technologies in electronic packaging.

Conclusion

BawChing Perng stands out as a significant figure in the realm of electronic component innovation. His contributions through various patents illustrate his commitment to advancing technology in the field. As he continues to innovate and collaborate with talented professionals, his work is bound to influence the future of electronic packaging solutions.