The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Jul. 25, 2019
Applicant:

Zhuhai Crystal Resonance Technologies Co., Ltd., Guangdong, CN;

Inventors:

Dror Hurwitz, Zhuhai, CN;

BawChing Perng, Zhuhai, CN;

Duan Feng, Zhuhai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H03H 9/58 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H03H 9/588 (2013.01); H01L 21/02118 (2013.01); H01L 21/76816 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/66 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2223/6616 (2013.01);
Abstract

A packaged electronic component comprising: an electronic component housed within a package comprising a front part of a package comprising an inner section with a front cavity therein opposite the electronic component defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads adapted to couple the package in a flip chip configuration to a circuit board.


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